4300 Peavey Road, Chaska, Minnesota 55318 | 952-442-2189 or 800-404-9028

Capabilities

  

 

     
FEATURE STANDARD ADVANCED
Line Width .003 .0015
Conductor Spacing .003 .002
Layer to Layer .002 .001
PCB Thickness +/- 10% +/- 5%
Profile Dimensions +/- .010 +/- .005
     
PAD AND HOLE    
Plated Hole (Minimum) .006 .0039
Aspect Ratio 10:1 21:1
PTH Tolerance +/- .003 +/- .002
Inner Layer Pads DIA. (Minimum) .020 over nominal .007 over nominal
Outer Layer Pads DIA. (Minimum) .020 over nominal .007 over nominal
     
LPI Solder Mask    
Dam Width .006 .003
SMT Pad Spacing .004 .003
Annular Ring (LPI) .002 .001
LPI Colors Available Green (std), Red, Blue, Black, Clear, Others upon Request
 
LINE WIDTH AND SPACES  
Copper Weight Finished Lines/Spaces Etch Compensation (per side)
.375 oz .0025/.003 .0005
.5 oz .003/.004 .001
1 oz .005/.005 .001
2 oz .005/.008 .002
3 oz .008/.010 .003
4 oz .010/.013 .005
5 oz .010/.018 .007
     
OTHER CAPABILITIES STANDARD ADVANCED
Panel Size (Std) 18" x 24" 12" x 18"
Panel Size (Max) 21" x 24" 21" x 28"
Maximum Board Thickness .187" .250"
Minimum Board Thickness .005 D/S .014 Multilayer
Minimum Core Thickness .004 .0005
Maximum Copper Thickness    
     Internal 5 oz 10 oz
     External 6 oz 75 oz (Selective)
Minimum Copper Thickness    
     Internal .5 oz .375 oz
     External .5 oz .250 oz
Maximum Layer Count 16 Layer 48 Layer
Surface Finishes ENIG, Immersion Silver, Electrolytic Hard Gold, OSP, Electrolytic Tin, Pb HASL, Pb Free HASL, Immersion Tin, ENIPEG, SoftGold.
Controlled Impedance + or – 5%, 7% & 10%
Non-Conductive HoleFill .018 .0059
Conductive HoleFill .019 .0079
Full Fill Copper  

 

 
COMMUNICATION FORMATS  
Drill Files Excellon V1, V2, SM1000 & SM3000  
Artwork Gerber Format (274X or 274 (with wheel)), ODB++, AUTOPLOT, BARCO, IGI  
Fabrication Drawings HPGL, DXF, DWG, PLT (274X & 274), JPEG, BITMAP, TIFF, “IMAGE” FILES, POSTSCRIPT
FTP Site ftp.protechmn.com (data)  
Netlist IPC356, IPC356A, Mentor Neutral File