Manufacturing

Pro-Tech is committed to investing in new, leading-edge equipment to provide our clients with the highest quality products.  Pro-Tech’s manufacturing processes are on the forefront of PCB manufacturing technology.  Pro-Tech’s 30,000 square-foot manufacturing facility is located in Chaska, Minnesota, USA.

Process Capability

  • 1 to 50+ layer multilayer packages

  • MIL PRF 55110 / MIL PRF 31032 certified (Polyimide (GI) 16Lyr and FR4 (GF) 20Lyr)

  • Controlled impedance modeling down to 15 ohm

  • High performance materials & specialty dielectrics

  • RF, Microwave, hi speed digital & hybrid solutions

  • ROHS Compliant material options

  • UL approved for heavy copper:

    Double sided max external at 170 microns (.0067” / approx. 4.95 oz)

    Multilayer max internal at 137 microns (.0054” / approx. 4 oz) and max external 132 microns (.0052” / approx. 3.85 oz)

  • Specialty power products selective plate Extreme copper up 100 mil + on outer layer copper, 160 mil internal slug designs

  • Down to .0013” trace & space

  • 0.4mm pitch BGA

  • 18:1 aspect ratio

  • Full copper via fill

  • Conductive/Non cond. hole fill (via down to .004”)

  • 6X Sequential lamination for Blind & Buried structures

  • Alternative surface finish options include:

    • ENIG - Bright Hard Au - Silver - HASL - OSP - Pb free HASL -White Tin -

      ENEPIG - Soft Au

  • Laser ablated micro via (0.004” 0.010”)

  • Rogers 92ML Series thermal conductive material / aluminum core / heavy copper parts

  • 3M Buried Capacitance (0.5mil & 0.75mil,16nF cm 2 decoupling) First to UL certify.

  • Thin core material (0.002” 0.004”)

  • CLTE / FR4, BT cavity designs. Plated & Non plated

  • .004 mechanically drilled holes

Capabilities

  

 

 

 

 

 

FEATURE

STANDARD

ADVANCED

Line Width

.003

.0015

Conductor Spacing

.003

.002

Layer to Layer

.002

.001

PCB Thickness

+/- 10%

+/- 5%

Profile Dimensions

+/- .010

+/- .005

 

 

 

PAD AND HOLE

 

 

Plated Hole (Minimum)

.006

.0039

Aspect Ratio

10:1

21:1

PTH Tolerance

+/- .003

+/- .002

Inner Layer Pads DIA. (Minimum)

.020 over nominal

.007 over nominal

Outer Layer Pads DIA. (Minimum)

.020 over nominal

.007 over nominal

 

 

 

LPI Solder Mask

 

 

Dam Width

.006

.003

SMT Pad Spacing

.004

.003

Annular Ring (LPI)

.002

.001

LPI Colors Available

Green (std), Red, Blue, Black, Clear, Others upon Request

 

LINE WIDTH AND SPACES

 

Copper Weight

Finished Lines/Spaces

Etch Compensation (per side)

.375 oz

.0025/.003

.0005

.5 oz

.003/.004

.001

1 oz

.005/.005

.001

2 oz

.005/.008

.002

3 oz

.008/.010

.003

4 oz

.010/.013

.005

5 oz

.010/.018

.007

 

 

 

OTHER CAPABILITIES

STANDARD

ADVANCED

Panel Size (Std)

18" x 24"

12" x 18"

Panel Size (Max)

21" x 24"

21" x 28"

Maximum Board Thickness

.187"

.250"

Minimum Board Thickness

.005 D/S

.014 Multilayer

Minimum Core Thickness

.004

.003

Maximum Copper Thickness

 

 

     Internal

5 oz

10 oz

     External

6 oz

75 oz (Selective)

Minimum Copper Thickness

 

 

     Internal

.5 oz

.375 oz

     External

.5 oz

.250 oz

Maximum Layer Count

16 Layer

48 Layer

Surface Finishes

ENIG, Immersion Silver, Electrolytic Hard Gold, OSP, Electrolytic Tin, Pb HASL, Pb Free HASL, Immersion Tin, ENIPEG, SoftGold.

Controlled Impedance

+ or – 5%, 7% & 10%

Non-Conductive HoleFill

.018

.0059

Conductive HoleFill

.019

.0079

Full Fill Copper

 

 

 

COMMUNICATION FORMATS

 

Drill Files

Excellon V1, V2, SM1000 & SM3000

 

Artwork

Gerber Format (274X or 274 (with wheel)), ODB++, AUTOPLOT, BARCO, IGI

 

Fabrication Drawings

HPGL, DXF, DWG, PLT (274X & 274), JPEG, BITMAP, TIFF, “IMAGE” FILES, POSTSCRIPT

FTP Site

ftp.protechmn.com (data)

 

Netlist

IPC356, IPC356A, Mentor Neutral File